首页 | 本学科首页   官方微博 | 高级检索  
     

共聚低热膨胀聚酰亚胺薄膜的制备与表征
引用本文:张明艳,高升,吴子剑,崔宏玉,高岩. 共聚低热膨胀聚酰亚胺薄膜的制备与表征[J]. 材料工程, 2019, 47(5): 153-158
作者姓名:张明艳  高升  吴子剑  崔宏玉  高岩
作者单位:哈尔滨理工大学材料科学与工程学院,哈尔滨150040;哈尔滨理工大学工程电介质及其应用技术教育部重点实验室,哈尔滨150080;哈尔滨理工大学材料科学与工程学院,哈尔滨,150040
基金项目:国家自然科学基金;黑龙江省博士后科学基金;中国博士后科学基金面上项目
摘    要:以4,4′-(六氟异丙烯)二酞酸酐(6FDA)为含氟二酐,4,4′-二氨基-2,2′-双三氟甲基联苯(TFMB)为含氟二胺,通过引入分子结构相对对称的刚性单体1,2,4,5-均苯四甲酸二酐(PMDA)进行共聚合成了5种含氟比例不同的透明聚酰亚胺薄膜,并对其性能进行了表征。分析表明:引入刚性单体共聚后薄膜的热稳定性和耐热性有所提高;薄膜的介电常数随着PMDA含量的上升而增加;共聚薄膜在可见光领域的透光率低于均聚薄膜;拉伸实验显示在添加少量PMDA后,薄膜的拉伸强度和弹性模量有所增大,但当PMDA含量过高时其力学性能反而下降;随着PMDA含量的增加,薄膜的热膨胀系数明显降低。

关 键 词:聚酰亚胺薄膜  透明  含氟  共聚  热膨胀系数

Preparation and characterization of low expansion transparent copolyimide films
ZHANG Ming-yan,GAO Sheng,WU Zi-jian,CUI Hong-yu,GAO Yan. Preparation and characterization of low expansion transparent copolyimide films[J]. Journal of Materials Engineering, 2019, 47(5): 153-158
Authors:ZHANG Ming-yan  GAO Sheng  WU Zi-jian  CUI Hong-yu  GAO Yan
Affiliation:(School of Materials Science and Engineering,Harbin University of Science and Technology,Harbin150040,China;Engineering Dielectrics and Its Application Key Laboratory(Ministry of Education),Harbin Universityof Scienceand Technology,Harbin 150080,China)
Abstract:Five transparent polyimide thin films with different proportions of1,2,4,5-,pyromellitic dianhydride (PMDA) were made by copolymerization of4,4′-(six fluoro isopropenyl) two phthalic anhydride (6FDA),4,4′- two amino -2,2′- double three trifluoromethyl biphenyl (TFMB) and PMDA, and their properties were characterized. The results show that thermal stability and heat resistance are increased after the introduction of rigid monomers;the dielectric constant of the films is increased with the increase of PMDA content;homopolymer film has higher light transmission rate than copolymer films in visible light;tensile test shows that adding a small amount of PMDA, the tensile strength and elastic modulus of the film are increased, but when the content of PMDA is higher than 40%, the mechanical properties are decreased;the coefficient of thermal expansion of the films are decreased obviously while PMDA content is increased.
Keywords:polyimide film  transparent  fluorine containing  copolymerization  coefficient of thermal expansion
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号