| 电镀金刚石线锯制造及切割技术研究 |
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| 引用本文： | 高玉飞,葛培琪,侯志坚,李绍杰. 电镀金刚石线锯制造及切割技术研究[J]. 制造技术与机床, 2007, 0(10): 89-91 |
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| 作者姓名： | 高玉飞 葛培琪 侯志坚 李绍杰 |
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| 作者单位： | 山东大学机械学院,山东,济南,250061 |
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| 基金项目： | 国家自然科学基金资助项目（No.50475132）,山东省自然科学基金资助项目（（No.Y2006F16） |
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| 摘 要： | 介绍了几种电镀金刚石线锯的制造方法，并介绍了往复式和环形两种金刚石线锯切片方法的原理。对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。适当提高锯丝的张紧力，在一定的变化范围内，采用高的锯丝速度和低的进给速度，可以获得好的切片表面质量。
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| 关 键 词： | 金刚石线锯 单晶硅 表面质量 切割 |
| 修稿时间： | 2007-01-30 |
Study on the Manufacture of Electroplated Diamond Wire Saw and Slicing Technology |
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| GAO Yufei,GE Peiqi,HOU Zhijian,LI Shaojie. Study on the Manufacture of Electroplated Diamond Wire Saw and Slicing Technology[J]. Manufacturing Technology & Machine Tool, 2007, 0(10): 89-91 |
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| Authors: | GAO Yufei GE Peiqi HOU Zhijian LI Shaojie |
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| Abstract: | The methods of manufacturing electroplated diamond wire saw are introduced, the principles of both reciprocating and looped wire - saw slicing technology are presented. The influences of technology param eters on silicon wafer surface quality when slicing are studied theoretically. Increasing the wire tension force properly,adopting the higher wire velocity and slower infeed velocity in a range, the high wafer surface quality can be obtained. |
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| Keywords: | Diamond Wire Saw Mono - crystalline Silicon Surface Quality Slicing |
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