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A 1.1 GHz 12 μA/Mb-Leakage SRAM Design in 65 nm Ultra-Low-Power CMOS Technology With Integrated Leakage Reduction for Mobile Applications
Authors:Yih Wang Hong Jo Ahn Bhattacharya  U Zhanping Chen Coan  T Hamzaoglu  F Hafez  WM Chia-Hong Jan Kolar  P Kulkarni  SH Jie-Feng Lin Yong-Gee Ng Post  I Liqiong Wei Ying Zhang Zhang  K Bohr  M
Affiliation:Intel Corp., Hillsboro;
Abstract:A low-power, high-speed SRAM macro is designed in a 65 nm ultra-low-power (ULP) logic technology for mobile applications. The 65 nm strained silicon technology improves transistor performance/leakage tradeoff, which is essential to achieve fast SRAM access speed at substantially low operating voltage and standby leakage. The 1 Mb SRAM macro features a 0.667 mum2 low-leakage memory cell and can operate over a wide range of supply voltages from 1.2 V to 0.5 V. It achieves operating frequency of 1.1 GHz and 250 MHz at 1.2 V and 0.7 V, respectively. The SRAM leakage is reduced to 12 muA/Mb at the data retention voltage of 0.5 V. The measured bitcell leakage from the SRAM array is ~2 pA/bit at retention voltage with integrated leakage reduction schemes.
Keywords:
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