| 基于有限元对Ag-Cu-Ti钎焊金刚石膜残余应力分析 |
| |
| 引用本文： | 穆云超,卢金斌. 基于有限元对Ag-Cu-Ti钎焊金刚石膜残余应力分析[J]. 金刚石与磨料磨具工程, 2006, 0(4): 26-28 |
| |
| 作者姓名： | 穆云超 卢金斌 |
| |
| 作者单位： | 中原工学院,材料与化学工程系,郑州,450007;中原工学院,材料与化学工程系,郑州,450007 |
| |
| 摘 要： | 采用Ansys有限元分析软件运用非线性分析的方法对Ag—Cu—n钎焊金刚石膜后的残余应力进行了数值模拟。在模拟中考虑了温度对材料性能的影响，计算了钎料对金刚石的热应力，并给出了钎料不同厚度情况下的残余应力。而后采用激光拉曼光谱对应力进行测量表明，有限元模拟结果与试验测试数据相吻合，相对误差不超过10％。
|
| 关 键 词： | 有限元 残余应力 金刚石膜 钎焊 |
| 文章编号： | 1006-852X(2006)04-0026-03 |
| 修稿时间： | 2006-02-25 |
Analysis of thermal stress of brazed diamond film With Ag-Cu-Ti filler alloy |
| |
| Mu Yunchao,LU Jinbin. Analysis of thermal stress of brazed diamond film With Ag-Cu-Ti filler alloy[J]. Diamond & Abrasives Engineering, 2006, 0(4): 26-28 |
| |
| Authors: | Mu Yunchao LU Jinbin |
| |
| Abstract: | The thermal stress after the brazing of diamond film with Ag-Cu-Ti filler alloy is simulated by the nonlinear finite element analysis of ANSYS software.Considering the effect of temperature,the thermal stress from filler is calculated,and the thermal stress in different thickness of filler is given.Then the stress is tested with Laser Raman,and the results proved that the calculated stress in brazing is reasonable and the relative error between them was less than 10%. |
| |
| Keywords: | finite element analysis thermal stress diamond brazing |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
