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Low-cycle fatigue prediction model for pb-free solder 96.5Sn-3.5Ag
Authors:C. Kanchanomai  Y. Mutoh
Affiliation:(1) Department of Mechanical Engineering, Faculty of Engineering, Thammasat University (Rangsit Campus), Khlong-Luang, 12121 Pathumthani, Thailand;(2) Department of Mechanical Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, 940-2188 Nagaoka, Japan
Abstract:Low-cycle fatigue (LCF) data of Sn-Ag eutectic solder (96.5Sn-3.5Ag) under various temperatures and frequencies has been described using three different prediction models, i.e., Coffin-Manson model, Smith-Watson-Topper (SWT) model, and Morrow energy model. The LCF behavior represented by the present prediction models showed temperature and frequency dependences, i.e., the fatigue ductility coefficient increased with increasing frequency and decreasing temperature. In order to better correlate the LCF data, a flow stress and/or frequency-dependent modifications were introduced to the Coffin-Manson and Morrow energy models. The frequency-modified Coffin-Manson model could not describe the influence of temperature on LCF behavior, while the flow stress-modified frequency-modified Morrow energy model, into which the metallurgical response (flow stress and frequency) was introduced to account for the effect of temperature and frequency on LCF behavior, gave reasonable predictions of LCF data under various temperatures and frequencies.
Keywords:Low-cycle fatigue  lead-free solder material  96.5Sn-3.5Ag  Coffin-Manson model  Smith-Watson-Topper model  Morrow energy model
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