| Al-Cu双金属复合结构的扩散连接试验研究 |
| |
| 引用本文： | 孟胶东,曲文卿,庄鸿寿. Al-Cu双金属复合结构的扩散连接试验研究[J]. 材料工程, 2003, 0(1): 34-37 |
| |
| 作者姓名： | 孟胶东 曲文卿 庄鸿寿 |
| |
| 作者单位： | 1. 北京青云航空仪表有限公司,北京,100086
2. 北京航空航天大学,北京,100083 |
| |
| 摘 要： | 应用扩散连方法进行了Al-Cu双金属复合结构的试验研究，比较了不同的焊接工艺，材料组合以及母材状态情况Al合金与Cu的连接性，观察了接头区域的微观组织结构，研究表明，固相扩散连接是一种适用于异种材料连接的有效方法，通过在连接区域形成Al-Cu金属间化合物，达到Al和Cu的有效连接，材料组合，母材原始状态以及连接工艺参数对Al合金与Cu的扩散连接存在着明显的影响。表面镀Ni工艺不但能够有效阻止Al和Cu之间形成脆性相，而且Al和Ni之间形成了良好的扩散连接，改善了接头性能。
|
| 关 键 词： | Al－Cu双金属复合结构 扩散连接试验 微观组织 铝铜合金 接头性能 |
| 文章编号： | 1001-4381(2003)01-0034-04 |
| 修稿时间： | 2002-06-06 |
Experimental Study on Diffusion Bonding of Al-Cu Bimetal Composite Structure |
| |
| MENG Jiao dong ,QU Wen qing ,ZHUANG Hong shou. Experimental Study on Diffusion Bonding of Al-Cu Bimetal Composite Structure[J]. Journal of Materials Engineering, 2003, 0(1): 34-37 |
| |
| Authors: | MENG Jiao dong QU Wen qing ZHUANG Hong shou |
| |
| Affiliation: | MENG Jiao dong 1,QU Wen qing 2,ZHUANG Hong shou 2 |
| |
| Abstract: | The experimental study on diffusion bonding of aluminium copper bimetal composite structure was conducted, and the influence of different welding process, materials combinations, and base metal status on weldability of aluminium alloy and copper was discussed, the joint microstructure was observed The results show that the solid state diffusion bonding is suitable for dissimilar materials bonding The Al Cu intermetallic compound is formed in the joint zone, so the effective bond can be obtained The factors such as material combinations, base metal status, and bonding parameters are all influent on diffusion bonding of aluminium alloy and copper Ni coating on the copper surface can prevent the Al Cu joint from formation of brittle phases, and because of interaction and inter diffusion between Al and Ni elements, the joint property is improved |
| |
| Keywords: | dissimilar metals diffusion bonding microstructure |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
