| SMT细间距工艺技术研究 |
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| 引用本文： | 程明生. SMT细间距工艺技术研究[J]. 电子工艺技术, 1998, 19(2): 51-53 |
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| 作者姓名： | 程明生 |
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| 作者单位： | 华东电子工程研究所 |
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| 摘 要： | 从ＰＣＢ设计，漏印模板设计与制造，焊膏应用以及组装工艺等方面。讨论了细间距ＳＭＴ工艺技术，提出相应的对策，这对提高细间距器件的焊接质量具有普遍意义。
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| 关 键 词： | SMT 细胞间距器件 模板 焊盘 焊膏 |
Research On Fine Pitch Technology of SMT |
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| Cheng Mingsheng Hu Jun Peng Jiaying. Research On Fine Pitch Technology of SMT[J]. Electronics Process Technology, 1998, 19(2): 51-53 |
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| Authors: | Cheng Mingsheng Hu Jun Peng Jiaying |
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| Affiliation: | Cheng Mingsheng Hu Jun Peng Jiaying |
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| Abstract: | Fine Pitch Technolgy is discussed from PCB design,the design and manufacture of stencil,the application of solaer paste and assembly process.In this paper,appropriate measures are suggested, these measures are of general importance to improve the solder quality of FPD. |
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| Keywords: | SMT Fine pitch device Stencil Solder pad Solder paste |
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