| 无铅器件逆向转化有铅器件工艺 |
| |
| 引用本文： | 孙守红. 无铅器件逆向转化有铅器件工艺[J]. 电子工艺技术, 2010, 31(5) |
| |
| 作者姓名： | 孙守红 |
| |
| 作者单位： | 中国科学院长春光学精密机械与物理研究所,吉林,长春,130033 |
| |
| 摘 要： | 通过对有铅焊料与无铅器件混用的工艺性问题与质量问题进行分析,论述了无铅器件逆向转化为有铅器件的必要性;介绍了无铅器件焊端材料以及对逆向转化工艺的影响;提出并重点论述了有引线无铅器件、无引线无铅器件和球形焊端无铅器件逆向转化为有铅器件的工艺方法.
|
| 关 键 词： | 无铅器件 逆向转化 电子组装 |
Reverse Technology from Lead-free Devices to Lead Devices |
| |
| SUN Shou-hong. Reverse Technology from Lead-free Devices to Lead Devices[J]. Electronics Process Technology, 2010, 31(5) |
| |
| Authors: | SUN Shou-hong |
| |
| Affiliation: | SUN Shou-hong(Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun 130033,China) |
| |
| Abstract: | Discuss the necessity of lead-free devices reverse transform into lead devices based on the analysis of the soldering process and quality of lead solder with lead-free devices.Introduce lead-free solder-side material,and the impact of lead-free solder-side material on reverse conversion processes.Present and discuss the methods of lead-free devices,solder ball terminal lead-free devices reverse transform into lead devices. |
| |
| Keywords: | Lead-free devices Reverse transformation Electronic assembly |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
