| 微桥法镍膜的弹性模量和残余应力测量 |
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| 引用本文： | 王明军,周勇,陈吉安,杨春生,张亚民,高孝裕,周志敏,张泰华. 微桥法镍膜的弹性模量和残余应力测量[J]. 电子元件与材料, 2004, 23(12): 13-16 |
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| 作者姓名： | 王明军 周勇 陈吉安 杨春生 张亚民 高孝裕 周志敏 张泰华 |
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| 作者单位： | 1. 上海交通大学微纳米科学技术研究院,薄膜与微细技术教育部重点实验室,上海,200030
2. 中国科学院力学研究所,非线性力学国家重点实验室,北京,100080 |
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| 基金项目： | 国家重点基础研究发展规划(973)项目(G1999033103) |
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| 摘 要： | 利用MEMS技术制作了不同尺寸的镍(Ni)膜微桥结构样品。采用纳米压痕仪XP系统测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了两种不同尺寸的Ni膜的弹性模量和残余应力。结果表明,两种不同尺寸的Ni膜的弹性模量结果一致,为190 GPa左右,但是残余应力变化较大。与采用纳米压痕仪直接测得的带有硅(Si)基底的Ni膜弹性模量186.8 7.5 GPa相比较,两者符合较好。
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| 关 键 词： | 材料测量与分析技术 镍膜微桥 MEMS技术 弹性模量 残余应力 |
| 文章编号： | 1001-2028(2004)12-0013-04 |
Measurements of Elastic Modulus and Residual Stress of Nickel Film by Microbridge Testing Methods |
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| WANG Ming-jun,ZHOU Yong,CHEN Ji-an,YANG Chun-sheng,ZHANG Ya-min,GAO Xiao-yu,Zhou Zhi-min,ZHANG Tai-hua. Measurements of Elastic Modulus and Residual Stress of Nickel Film by Microbridge Testing Methods[J]. Electronic Components & Materials, 2004, 23(12): 13-16 |
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| Authors: | WANG Ming-jun ZHOU Yong CHEN Ji-an YANG Chun-sheng ZHANG Ya-min GAO Xiao-yu Zhou Zhi-min ZHANG Tai-hua |
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| Affiliation: | WANG Ming-jun1,ZHOU Yong1,CHEN Ji-an1,YANG Chun-sheng1,ZHANG Ya-min1,GAO Xiao-yu1,Zhou Zhi-min1,ZHANG Tai-hua2 |
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| Abstract: | Different size samples of nickel film microbridges were managed to be fabricated by the MEMS technique. A Nanoindenter XP system was used in order to get the load-deflection curves of Nickel film bridge. Theoretical analysis of the microbridge load-deflection curve was proposed to evaluate the elastic modulus and residual stress of the films simultaneously. The calculated results based on the experimental measurements show that the average elastic modulus of nickel films is around 190 GPa,which is coincident with the results measured by nano-hardness method on the same nickel film based on silicon substrate. However, the difference in residual stress is larger because the residual stress can be easily affected by the fabrication conditions and size of the samples. |
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| Keywords: | measuring and analysis for materials nickel film microbridge MEMS elastic modulus residual stress |
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