Convective heat transfer from simulated air-cooled printed-circuit board assembly on horizontal or vertical orientation |
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| Affiliation: | 1. School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;2. Shenyang Blower Works Group Saw Electro-Mechanics Import&Export Corporation, Shenyang 110021, China;1. College of Information Science & Electronics Engineering, Zhejiang University, Hangzhou, China;2. Department of Computer Science and Engineering, University of Notre Dame, Notre Dame, IN, USA;1. University of Lille, France;2. Universidad de la República, Uruguay;3. The University of Sydney, Australia;4. University of Luxembourg, Luxembourg |
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| Abstract: | An experimental and numerical analyses had been performed to investigate the convective heat transfer in a rectangular duct flow with streamwise-periodic rectangular heated ribs mounted on one of the principal walls, which simulated a printed-circuit board (PCB) assembly. Experimental investigation were carried out with the PCB assembly orientated in both horizontal and vertical positions. Effects of varying the duct's height, and the rib's height and width on convection from the rib's surface to the air-flow were studied. The heat transfer measurements were obtained for unencumbered height-based Reynolds number from 510 to 2050. Predictive correlations valid over a range of Reynolds numbers, duct height-to-rib height ratios (H/B) and rib's width-to-height ratios (L/B) were proposed. |
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