Interface structure and wetting behaviour of Cu/Ti3SiC2 system

Wetting behaviour of a Cu/Ti₃SiC₂ system was investigated by the sessile drop technique under a vacuum atmosphere. Contact angles between Cu and Ti₃SiC₂ changed from 95 to 15° as temperatures increased from 1089 to 1270°C. Two distinct reaction layers consisting of different contents of Cu, TiC_x, Ti₃SiC₂ and Cu_xSi_y intermetallics were formed at the interface of Cu and Ti₃SiC₂. The formation of the interface layers contributes to the improvement of the wettability of the system. The dissolution of Si from theTi₃SiC₂ into the molten Cu at high temperature plays a dominant role in the wetting behaviour of Cu/Ti₃SiC₂ systems.