Ag-Cu-Ti活性钎料真空钎焊钼和石墨结合质量研究

为了实现石墨与钼的高强连接,实验采用活性钎料Ag-Cu-Ti作为填充材料,研究了钎焊过程中采用的工艺及不同种类石墨对真空钎焊接头组织结构和性能的影响,进一步探讨了界面结合机理.利用光学显微镜分析了接头微观形貌,采用能谱仪确定了接头的成分分布,采用自行设计的模具测试了接头的剪切强度.结果表明,Ag-Cu-Ti钎科与两侧钼和石墨基体均形成了良好的结合界面,接头抗剪强度达到了石墨基材强度的80%以上;石墨密度对接头性能的影响比较大,导致钎缝区出现不同的界面形貌.可以通过表面物理改性的方法改善接头质量.

Study on bond quality of mo and graphite by vacuum brazing with Ag-Cu-Ti filler matal

By inserting Ag-Cu-Ti foil as interlayer,the high-strength joints of Graphite and Mo were formed by vacuum brazing.The microstructrue and strength of the joints have been studied,also the interface bonding mechanism was investigated.The joints microstructures and elements distribution were studied by OM and EDS analyses,and the shear strength was tested.The results show that the strength of the brazing joints achieved 80% strength of Graphite due to its good weld.The different density of the Graphite leads ...