| Ag、RE对Sn-Ag-Cu-RE无铅钎料润湿性的影响 |
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| 引用本文： | 王双其,张柯柯,樊艳丽,王要利,杨洁,程光辉,韩丽娟.Ag、RE对Sn-Ag-Cu-RE无铅钎料润湿性的影响[J].热加工工艺,2006(3). |
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| 作者姓名： | 王双其 张柯柯 樊艳丽 王要利 杨洁 程光辉 韩丽娟 |
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| 作者单位： | 河南科技大学材料科学与工程学院 河南洛阳471003 |
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| 基金项目： | 河南省高校创新人才基金资助项目(教高2004-294)，河南省高校杰出科研人才创新工程资助项目(2004KY-CX020)，河南省青年骨干教师基金资助项目([2002]114)。 |
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| 摘 要： | 采用商用水洗钎剂,以铺展面积和润湿角来表征钎料的润湿性能,研究了Ag、RE对Sn-Ag-Cu-RE系无铅钎料润湿性的影响。结果表明,添加微量RE有助于提高其润湿性。在无铅钎料中Sn-2.5Ag-0.7Cu-0.1RE钎料具有良好的润湿特性,其在铜板上润湿性接近Sn-Pb钎料的水平。
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| 关 键 词： | 无铅钎料 铺展面积 润湿性 |
Effect of Silver and Rare Earths on Wetting Properties of Sn-Ag-Cu-RE Lead-free Solder |
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| WANG Shuang-qi,ZHANG Ke-ke,FAN Yan-li,WANG Yao-li,YANG Jie,CHENG Guang-hui,HAN Li-juan.Effect of Silver and Rare Earths on Wetting Properties of Sn-Ag-Cu-RE Lead-free Solder[J].Hot Working Technology,2006(3). |
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| Authors: | WANG Shuang-qi ZHANG Ke-ke FAN Yan-li WANG Yao-li YANG Jie CHENG Guang-hui HAN Li-juan |
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| Abstract: | The effect of silver and rare earths on wetting properties of Sn-Ag-Cu-RE lead-free solder by adopting commercial water-soluble flux was researched by means of spread area and wetting angle. The experiments show that the tiny addition RE has improved the wetting properties of alloy. And it has better wetting properties in lead-free solder. The wetting properties of Sn-2.5Ag-0.7Cu-0.1RE on copperplate is near the level of that of Sn-Pb solder. |
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| Keywords: | lead-free solder spread area wetting property |
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