| 微胶囊技术及其在固化环氧体系中的应用 |
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| 引用本文： | 刘 宁,刘胭芝.微胶囊技术及其在固化环氧体系中的应用[J].包装学报,2011,3(4):39-44. |
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| 作者姓名： | 刘 宁 刘胭芝 |
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| 作者单位： | 湖南工业大学包装与材料工程学院,湖南株洲,412007;湖南工业大学包装与材料工程学院,湖南株洲,412007 |
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| 摘 要： | 阐述了微胶囊表面形态、粒度、厚度、包埋率、机械强度、渗透性、热稳定性能等的检验方法与表征，介绍了界面聚合法、原位聚合法和溶剂蒸发法3种固化剂或促进剂的微胶囊化技术，综述了微胶囊技术在固化环氧体系中的应用，并展望了其发展前景。
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| 关 键 词： | 微胶囊 微胶囊技术 固化剂 环氧体系 |
| 收稿时间： | 2011/4/18 0:00:00 |
Microcapsule Technology and Its Application in Curing Epoxy Systems |
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| Liu Ning and Liu Yanzhi.Microcapsule Technology and Its Application in Curing Epoxy Systems[J].Packaging Journal,2011,3(4):39-44. |
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| Authors: | Liu Ning and Liu Yanzhi |
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| Affiliation: | School of Packaging and Material Engineering, Hunan University of Technology;School of Packaging and Material Engineering, Hunan University of Technology |
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| Abstract: | The analysis and characterization of microcapsules are described, including surface morphology, size, thickness, embedding rate, mechanical strength, permeability and thermal stability. Three microencapsulations of curing agent or accelerator agent are introduced as interfacial polymerization, situ polymerization and solvent evaporation. Furthermore, the application of microcapsulation is proposed in the epoxy curing agent systems and is prospected for development. |
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| Keywords: | microcapsule microencapsulation curing agent curing system of epoxy resin |
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