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| 模压温度、压力和原料预热对聚碳酸酯厚板性能的影响 | |
| 引用本文： | 雷佑安,曾繁涤,刘丽华,熊传溪.模压温度、压力和原料预热对聚碳酸酯厚板性能的影响[J].工程塑料应用,2011,39(8):40-43. |
| 作者姓名： | 雷佑安 曾繁涤 刘丽华 熊传溪 |
| 作者单位： | 1. 河南城建学院化学与化学工程系,平顶山,467036 2. 华中科技大学化学与化工学院,武汉,430074 3. 武汉理工大学材料科学与工程学院,武汉,430070 |
| 基金项目： | 国家自然科学基金项目(50902075); 河南省科技计划项目(102102210480); 河南省教育厅自然科学研究指导计划项目(2010B430001) |
| 摘 要： | 研究了模压温度、模压压力以及原料预热等工艺条件对聚碳酸酯(PC)厚质板材制品密度、拉伸强度以及形态结构的影响.研究结果表明,采用先预热-模压成型的PC板材密度、力学性能优于直接模压成型制品,其最佳工艺为:200℃预热处理1h,240/10 MPa压力下模压30 rin.所得制品密度为1.19 g/cm3,拉伸强度可达到... |
| 关 键 词： | 聚碳酸酯 模压工艺 加工性能 力学性能 |
STUDY ON MOLDING OF THE PC THICK BOARD |
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| Lei Youan,Zeng Fandi,Liu Lihua,Xiong Chuanxi.STUDY ON MOLDING OF THE PC THICK BOARD[J].Engineering Plastics Application,2011,39(8):40-43. | |
| Authors: | Lei Youan Zeng Fandi Liu Lihua Xiong Chuanxi |
| Affiliation: | Lei Youan1,Zeng Fandi2,Liu Lihua1,Xiong Chuanxi3(1.Department of Chemistry and Chemical Engineering,Henan University of Urban Construction,Pingdingshan467036,China,2.School of Chemistry & Chemical Engineering,Huazhong University of Science and Technology,Wuhan430074,3.School of Materials Science and Engineering,Wuhan University of Technology,Wuhan430070,China) |
| Abstract: | A PC thick board with higher mechanical properties was prepared through molding processing.Our investigation result showed that the board through preheat-molding had higher density and better mechanical properties than that through direct molding progress.Preheating the PC for an hour at 200℃and molding 30 minutes at 240℃,10 MPa was the optimal progress to prepare PC thick board. |
| Keywords: | polycarbonate molding processing properties mechanical properties |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |