| 多层复杂结构准LIGA一体化加工工艺的研究 |
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| 引用本文： | 姜勇,陈文元,赵小林,丁桂甫,倪志萍,王志民.多层复杂结构准LIGA一体化加工工艺的研究[J].微细加工技术,2005(1):75-78. |
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| 作者姓名： | 姜勇 陈文元 赵小林 丁桂甫 倪志萍 王志民 |
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| 作者单位： | 上海交通大学,微纳米科学技术研究院,薄膜与微细技术教育部重点实验室微米与纳米加工技术国家级重点实验室,上海,200030 |
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| 基金项目： | 国家863计划资助项目(2003AA404210) |
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| 摘 要： | 准LIGA加工工艺通常只能加工单层准三维体。本研究采用SU-8胶准LIGA技术，解决了多层套刻、种子层和表面活化等技术难题，加工出了三维五层一体化复杂结构。实践证明，所提出的工艺实际可行，进一步拓展了准LIGA工艺的应用。
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| 关 键 词： | 准LIGA SU-8胶 套刻 种子层 表面活化 |
| 文章编号： | 1003-8213(2005)01-0075-04 |
| 修稿时间： | 2004年6月28日 |
Process Research of Complicated Multiple-layer Microstructure Using UV-LIGA |
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| JIANG yong,CHEN Wen-yuan,ZHAO Xiao-lin,DING Gui-fu,NI Zhi-ping,WANG Zhi-min.Process Research of Complicated Multiple-layer Microstructure Using UV-LIGA[J].Microfabrication Technology,2005(1):75-78. |
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| Authors: | JIANG yong CHEN Wen-yuan ZHAO Xiao-lin DING Gui-fu NI Zhi-ping WANG Zhi-min |
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| Abstract: | UV-LIGA process is conventionally used for 2.5 dimensions and single layer structure. Using SU-8 based UV-LIGA and overcoming difficulties in overlap of multiple layers, difficulties in seed layer technology as well as difficulties in surface activation, we fabricated a 3-dimension and 5-layer structure. The process given here is proved to be practical and it expands the application of UV-LIGA. |
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| Keywords: | UV-LIGA SU-8 resist overlap seed layer surface activation |
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