粗化液中钯离子对ABS塑料直接电镀的影响

粗化是实现活化液在ABS表面吸附的前提和获得良好结合力的必要条件.采用含痕量钯离子的铬酐-硫酸粗化液对ABS塑料表面进行化学粗化,用AFM、XPS和胶体钯吸附量等对粗化前后塑料的表面性能、价键状态和活性进行了考察.结果表明:钯离子加入到粗化液中对ABS表面的粗糙度影响不显著,粗化后的表面氧含量升高;随着粗化液中钯离子浓度的增加,胶体钯在ABS表面上的吸附量增加;增加粗化液中的Pd含量可使ABS表面在低浓度胶体钯溶液中达到与高浓度钯相同的吸附量,有效地降低了胶体钯的浓度.粗化液中加入钯离子不影响基体与镀层的结合力.

Influence of Pd ions in the chemical etching solution on direct copper plating

The etching is the essential condition which makes activation adsorbing on ABS surface and acquires good cohension.ABS surface was etched by dipping into chromic acid-sulfuric acid containing trace amount of palladium.The surface roughness,activity and valence bond were characterized by atomic force microscopy(AFM),X-ray photoelectron spectroscopy(XPS) and the amount of palladium adsorption.The results showed that the ABS surface roughness wasn’t affect by the Pd ions in etching solution.The oxygen content increases and forms a large amount of polar functional group after etching contained Pd ions,thus the amount of colloids palladium adsorption increased.The same Pd adsorption can be obtained from the lower concentration of Pd colloids solution by increasing of Pd ions in etching solution.The cohesion between copper layer and ABS plastics wasn’t affected by the etching solution contained Pd ions.