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Effect of additional iron and tin on the diffusion reaction at Sn-Cu alloy interface |
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| Authors: | Michihiko Inaba Koichi Teshima Osamu Hirao Toshiharu Sakurai |
| Affiliation: | (1) Materials Application Department, Toshiba Research and Development Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa-ken, Japan;(2) Semiconductor Industrial Engineering Department, Semiconductor Division, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa-ken, Japan |
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