压接式IGBT模块的开关特性测试与分析

随着柔性直流输电技术朝着更高电压等级、更大系统容量方向的发展,作为其中关键设备的换流阀和混合式直流断路器对大容量IGBT器件的封装特性和电气性能提出了更高要求。与焊接式IGBT相比,压接式IGBT具有功率等级更高、开关速度更快、易于串联等优点,成为柔性直流输电的优选器件。为系统掌握压接式IGBT模块的应用特性,设计了基于双脉冲测试原理的压接式IGBT模块开关特性的测试平台。基于测试结果,分析了不同压接力、负载参数和结温条件对压接式IGBT模块开关特性的影响规律;并从器件封装特性和半导体物理层面、初步探讨了压接式IGBT模块开关特性的变化机理,为其在大功率电力变换领域的推广和应用提供参考。

Test and Analysis of Switching Performance for Press-pack IGBT Modules

With the development of voltage source converter based high voltage direct current(VSC-HVDC) technology to higher voltage rating and higher power capacity, the converter valve and hybrid direct current breaker, which are the core components of VSC-HVDC, have put forwards higher demands on IGBT package feature and electrical performance. Compared with the solder plastic IGBT modules, the press-pack IGBT modules, are becoming preferred in the field of VSC-HVDC which feature higher power rating, faster switching speed and are more easily to be connected in series. In this paper, a test platform of switching performance for press-pack IGBT modules is designed and implemented to employ the principle of double pulse test. The effects of the external mechanical mounting force, bus voltage, load current and junction temperature on switching performance are analyzed in detail, and the variation mechanism of switching performance for press-pack IGBT is discussed preliminarily from the view of module''s package feature and semiconductor knowledge.