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Fabrication of planar and three-dimensional microcoils on flexible substrates
Authors:M. Woytasik  J.-P. Grandchamp  E. Dufour-Gergam  E. Martincic  J.-P. Gilles  S. Megherbi  V. Lavalley  V. Mathet
Affiliation:1. Institut d’Electronique Fondamentale, UMRCNRS 8622, batiment 220, Université Paris Sud, 91405, Orsay cedex, France
2. Laboratoire des Matériaux et du Génie Physique, ENSPG, Domaine Universitaire, BP 46, 38402, Saint Martin d’Hères Cedex, France
Abstract:Inductors are basic components of magnetic sensors. Generally, with those sensors, a weak magnetic variation has to be detected. As the sensitivity increases with the inductance value, our objectives are to design inductors with a maximum of turns while keeping millimetric sizes for the sensor. In this work, we present two microcoil fabrication processes compatible with rigid and flexible substrates. The first one is used for the realization of planar microcoils with one step of copper micromoulding. For example, a 40-turn microcoil of 1 mm external diameter and 5 μm copper width and spacing wires has been obtained. The second process allows the fabrication of three-dimensional microcoils (microsolenoids). It is based on two steps of copper micromoulding. In this process, a grey-tone photolithography step is implemented. Microsolenoids with 10–13 wires have been realized.
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