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Deformation behavior of dispersion-strengthened copper at high temperature
作者姓名:WANG  Mengjun  ZHANG  Yingchun  LUO  Yun  LIU  Xinyu
作者单位:[1]School of Material Science and Engineering, Central South University, Changsha 410083, China [2]Guilin College of Electronic Technology, Guangxi 541004, China
摘    要:1. Introduction Dispersion-strengthened copper (DSC) is a promising material developed recently. Considerable attention has been focused on it because of its excel- lent high-temperature properties. The metallic mate- rial, which is strengthened by solution strengthening, deformation strengthening, and ageing strengthening, is always low at high temperature, and the strength- ening factor contradicts with the electrical conduc- tivity of the material to a certain extent 1-2]. But DSC has g…

关 键 词:形变行为  色散加固    高温  金属学
收稿时间:2005-11-23

Deformation behavior of dispersion-strengthened copper at high temperature
WANG Mengjun ZHANG Yingchun LUO Yun LIU Xinyu.Deformation behavior of dispersion-strengthened copper at high temperature[J].Rare Metals,2006,25(6):687-692.
Authors:WANG Mengjun  ZHANG Yingchun  LUO Yun  LIU Xinyu
Affiliation:1. School of Material Science and Engineering, Central South University, Changsha 410083, China
2. Guilin College of Electronic Technology, Guangxi 541004, China
Abstract:The deformation behavior of dispersion-strengthened copper with different compositions was investigated by hot compression simulation tests on a Gleeble-1500 thermal-mechanical simulator. The microstructure during deformation at high temperature was also studied. The result shows that at the beginning of hot compression simulation, the flowing stress of the dispersion-strengthened copper quickly attains a peak value and the stress shows a greater decrease when the temperature is higher and the strain rate is lower. The dispersion particles lead to an obvious increase in the recrystallization temperature. Under experimental conditions, dynamic recovery is the main softening method. The constitutive equation at high temperature of 1.2%Al2O3-0.4%WC/Cu is obtained.
Keywords:dispersion-strengthened copper  thermal simulation  flowing stress  microstructure  constitutive equation
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