| 微量Ni对Sn-3.0Ag-0.5Cu钎料及焊点界面的影响 |
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| 引用本文： | 王丽凤,申旭伟,孙凤莲,刘洋.微量Ni对Sn-3.0Ag-0.5Cu钎料及焊点界面的影响[J].电子元件与材料,2008,27(9). |
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| 作者姓名： | 王丽凤 申旭伟 孙凤莲 刘洋 |
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| 作者单位： | 哈尔滨理工大学,材料科学与工程学院,黑龙江,哈尔滨,150040 |
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| 基金项目： | 国家自然科学基金，哈尔滨市科技创新人才研究专项资金资助项目 |
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| 摘 要： | 研究了Ni的含量对无铅钎料Sn-3.0Ag-0.5Cu润湿性、熔点、重熔及老化条件下界面化合物(IMC)的影响。结果表明:微量Ni的加入使SnAgCu润湿力增加6%;使合金熔点略升高约3℃;重熔时在界面形成了(Cu,Ni)6Sn5IMC层,且IMC厚度远高于SnAgCu/Cu的Cu6Sn5IMC厚度。在150℃老化过程中,SnAgCuNi/Cu重熔焊点IMC随着时间的增加,其增幅小于SnAgCu/Cu的增幅,此时Ni对IMC的增长有一定抑制作用。
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| 关 键 词： | 电子技术 镍 无铅钎料 焊点界面 |
Effect of micro amount Ni on Sn-3.0Ag-0.5Cu solder and interface of solder joint |
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| WANG Li-feng,SHEN Xu-wei,SUN Feng-lian,LIU Yang.Effect of micro amount Ni on Sn-3.0Ag-0.5Cu solder and interface of solder joint[J].Electronic Components & Materials,2008,27(9). |
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| Authors: | WANG Li-feng SHEN Xu-wei SUN Feng-lian LIU Yang |
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| Affiliation: | WANG Li-feng,SHEN Xu-wei,SUN Feng-lian,LIU Yang (School of Material Science , Engineering,Harbin University of Science , Technology,Harbin 150040,China) |
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| Abstract: | Effects of micro amount Ni on the wettability and melting point, intermetallic compounds (IMC) under thermal aging and reflow of the SnAgCu lead-free solder were investigated. The results show that the wetting force and the alloy melting point increase 6% and about 3 ℃, respectively with the addition of micro amount of Ni; the layer of (Cu, Ni)6Sn5 IMC is formed with a much larger thickness than that of Cu6Sn5 IMC in the SnAgCu/Cu on the interface. The thickness of IMC layers in the SnAgCuNi/Cu reflow solder joints grow less in the process of thermal aging at 150 ℃ than that of SnAgCu/Cu solder joints, Ni confines IMC grow in this condition. |
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| Keywords: | electron technology Ni lead-free solder interface of solder joint |
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