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Thermophysical characterization of a laminated solid-wood pine wall
Authors:Saed Raji  Yves Jannot  Philippe Lagière  Jean Rodolphe Puiggali
Affiliation:1. TREFLE, Université de Bordeaux, CNRS, Esp. Des Arts et Métiers, 33405 Talence, France;2. LEMTA, Nancy-Université, CNRS, 2, avenue de la Forêt de Haye, 54504 Vandoeuvre, France
Abstract:The experimental results obtained by the thermophysical characterization of a wall made of stacked laminated solid-wood planks are reported in this article. The interface between two logs is filled with a felt packing that is compressed under the weight of the upper plank. The characteristics which affect heat, air and water vapour transfers through the wall have been determined, i.e. the sorption isotherm, density, thermal conductivity and diffusivity, water vapour diffusion coefficient, and air permeability of the wall. The results achieved demonstrate the influence of the presence of the laminating adhesive on water vapour and air diffusion, and the influence of the presence of the felt packing on air permeability. The result is that the hygrothermal behaviour of the wall studied cannot be described properly by simply taking into account the properties of the solid wood, and it is thus necessary to determine the global properties of the composite wall.
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