| 焊膏及印刷技术 |
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| 引用本文： | 蒋东华,董军. 焊膏及印刷技术[J]. 印制电路信息, 2003, 0(12): 59-61 |
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| 作者姓名： | 蒋东华 董军 |
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| 作者单位： | 江南计算技术研究所,214083 |
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| 摘 要： | 网印质量的好坏对产品的质量起着决定性作用,因此受到广泛关注。本文主要讨论提高漏印质量的基本要素及 避免印刷缺陷的主要措施。
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| 关 键 词： | 锡膏 模板 印刷缺陷 PCB |
Solder Paste and Printing Technology |
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| Jiang Donghua Dong Jun. Solder Paste and Printing Technology[J]. Printed Circuit Information, 2003, 0(12): 59-61 |
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| Authors: | Jiang Donghua Dong Jun |
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| Affiliation: | Jiang Donghua Dong Jun |
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| Abstract: | As the quality of solder printing has an decisive impact on product's quality,this technology is given broad attention.This paper discusses the basic factors of improving the printing's quality and the main measure of avoiding the printing's limitation. |
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| Keywords: | solder paste stencil limitation of printing PCB |
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