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On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints |
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| Authors: | KE YazzieHX Xie JJ WilliamsN Chawla |
| Affiliation: | Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ 85287-6106, USA |
| Abstract: | |
| Keywords: | Mechanical shock Pb-free solder Intermetallic compound Cu6Sn5 Ductile fracture |
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