|
|||||
|
|
| 非离子表面活性剂对助焊剂润湿性能的影响 | |
| 引用本文： | 徐冬霞,王东斌,韩飞,雷永平.非离子表面活性剂对助焊剂润湿性能的影响[J].电子元件与材料,2010,29(9). |
| 作者姓名： | 徐冬霞 王东斌 韩飞 雷永平 |
| 作者单位： | 1. 河南理工大学,材料科学与工程学院,河南,焦作,454000 2. 中兵光电科技股份有限公司,北京,100176 3. 北京工业大学,材料科学与工程学院,北京,100124 |
| 基金项目： | 河南理工大学博士基金，河南理工大学金属材料及加工工程学科发展基金 |
| 摘 要： | 在软钎焊免清洗助焊剂中分别添加了3种不同含量的非离子表面活性剂:TritonX—100、Tween—20和PEG2000,得到了3组助焊剂。使用这3组助焊剂和Sn0.7Cu无铅钎料在纯铜板上进行了铺展测试。结果表明,添加TritonX—100和添加Tween—20的质量分数均为0.6%时,钎料的润湿角最小值分别为30.07°和29.70°,铺展面积最大值分别为56.67mm2和58.53mm2;添加PEG2000质量分数为0.3%时,钎料的润湿角最小值为26.70°,铺展面积最大值为66.88mm2,比未添加时增加26.9%。适量加入非离子表面活性剂能够改善助焊剂的润湿性,并提高无铅钎料的铺展能力。 |
| 关 键 词： | 软钎焊 免清洗助焊剂 非离子表面活性剂 润湿性 无铅钎料 |
Effect of nonionic surfactants on wettability of the soldering flux |
|
| XU Dongxia,WANG Dongbin,HAN Fei,LEI Yongping.Effect of nonionic surfactants on wettability of the soldering flux[J].Electronic Components & Materials,2010,29(9). | |
| Authors: | XU Dongxia WANG Dongbin HAN Fei LEI Yongping |
| Affiliation: | XU Dongxia1,WANG Dongbin1,HAN Fei2,LEI Yongping3(1.College of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454000,Henan Province,China,2.China North Optical-electrical Technology Co.,Ltd,Beijing 100176,3.College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China) |
| Abstract: | Three kinds of nonionic surfactants(Triton X—100,Tween—20 and PEG2000) were added into the no-clean soldering fluxes,thus three groups of fluxes were gained.Experiments of solder spreadability were carried out on the pure copper plates with three groups of fluxes and Sn0.7Cu lead-free solder.The results show that when the mass fraction of nonionic surfactants Triton X—100 and Tween—20 both are 0.6%,the minimum wetting angles are 30.07° and 29.70°,respectively,and the maximum spread areas are 56.67 mm2 and 58.53 mm2,respectively.When the mass fraction of PEG2000 is 0.3%,the minimum wetting angle is 26.70° and the maximum spread area is 66.88 mm2 which is increased by 26.9% compared with that of the soldering flux with no PEG2000 addition.It is obvious that appropriate addition of nonionic surfactants can improve the wettability of soldering flux and enhance the spreadability of the lead-free solder. |
| Keywords: | soldering no-clean soldering flux nonionic surfactant wettability lead-free solder |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |