亚微米级硅尖端传感器的研制

提出了一种全新的亚微米级温度传感器的构想。作者在借鉴AFM悬臂测头的基础上，采用了微机械加工技术中的各向同性和各向异性腐蚀技术，在硅材料上完成了悬臂梁与硅尖制作。制成的梁的厚度在6μm左右、尖端曲径半径远小于1μm。随后对悬臂梁前端的硅尖进行尖端放电，隧穿其顶端的Si_3N_4层形成温敏器件──一个微型的热电偶。最后进行了这一温敏传感器的引线和封装。由于制作所形成的硅尖曲径半径在0．1μm左右，从而可以在其尖顶上形成亚微米级的温度传感器，在集成电路的探伤与修补以及生物技术领域，有着广阔的应用前景。

Development of a Submicron Si-tip Sensor

A new design of submicron St-tip sensor is presented in this paper.Using the construction of AFM for reference St-tips and cantilevers are constructedon Si substrate by microfabrication and IC fabrication techniques. The thickness ofcantilevers is about 6 μm and radius of tips is far less than 1 μm. By exerting voltagebetween the tip and substrate,the Si_3N_4 layer on the top of tips are broken throughto form a temperature sensor, a mini thermocouple. Finally, leads and potting ofthese sensors are designed. For the thermocouple is on the top of a tip and radius ofthe tip is no more than 30 nm,so the sensor can be widely used in the field of biology,medical science and IC crack detection and reparation.