| 平纹编织C/SiC复合材料层间断裂行为试验研究 |
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| 引用本文： | 陈刘定,童小燕,程起有,姚磊江.平纹编织C/SiC复合材料层间断裂行为试验研究[J].机械强度,2012,34(1):97-101. |
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| 作者姓名： | 陈刘定 童小燕 程起有 姚磊江 |
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| 作者单位： | 1. 西北工业大学无人机特种技术国防科技重点实验室,西安710065;西北工业大学航空学院,西安710072
2. 西北工业大学无人机特种技术国防科技重点实验室,西安,710065 |
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| 基金项目： | 国家自然科学基金资助项目 |
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| 摘 要： | 通过双悬臂梁和端部切口弯曲试验分别对平纹编织C/SiC复合材料的Ⅰ型(张开型)和Ⅱ型(滑开型)层间断裂行为进行试验研究,得到该材料以临界能量释放率GⅠC和GⅡC表征的层间断裂韧度值.试验后利用光学显微镜对两组试验的试样断口进行显微观察,以分析其破坏机理.结果表明:Ⅰ型层间断裂韧度值GⅠC和Ⅱ型层间断裂韧度值GⅡC分别为(737.2±57) J/m2和(1082.7±90) J/m2；Ⅰ型开裂为层间SiC基体沿初始裂纹方向的断裂破坏；Ⅱ型开裂与Ⅰ型开裂相似,但裂纹上下表面包裹碳纤维束的SiC基体发生脱落,并且出现碳纤维束中部分碳纤维剪切破坏.
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| 关 键 词： | 平纹编织 C/SiC 断裂韧度 双悬臂梁 端部切口弯曲 |
EXPERIMENTAL INVESTIGATION ON INTERLAMINAR FRACTURE BEHAVIOR OF PLAIN WEAVE C/SIC COMPOSITES |
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| CHEN LiuDing
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TONG XiaoYan
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CHENG QiYou
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YAO LeiJiang.EXPERIMENTAL INVESTIGATION ON INTERLAMINAR FRACTURE BEHAVIOR OF PLAIN WEAVE C/SIC COMPOSITES[J].Journal of Mechanical Strength,2012,34(1):97-101. |
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| Authors: | CHEN LiuDing TONG XiaoYan CHENG QiYou YAO LeiJiang |
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| Affiliation: | 1(1.National Key Laboratory of Science and Technology on UAV,Northwestern Polytechnical University, Xi’an 710065,China)(2.School of Aeronautics,Northwestern Polytechnical University,Xi’an 710072,China) |
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| Abstract: | Double cantilever beam(DCB) and end notched flexure(ENF) experiments were performed to investigate the mode Ⅰand mode Ⅱ interlaminar fracture behavior of plain weave C/SiC composites,respectively.The fracture toughnesses of the two interlaminar fracture modes characterized by critical energy release rate GⅠC and GⅡC were obtained.After experiments,specimen fracture surfaces of the two groups of experiments were observed by optical microscope to analyze their fracture mechanisms.The experimental results indicate that,mode Ⅰ fracture toughness and mode Ⅱfracture toughness are about(737.2±57)J/m2 and(1 082.7±90)J/m2,respectively.Interlaminar matrix fracture along the initial crack is the main fracture mechanism of mode Ⅰ fracture.Mode Ⅱ fracture has the same main fracture mechanism as that of mode Ⅱ fracture.Moreover,SiC matrix around the C bundle fell off partially and part of the C bundle was sheared to failure. |
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| Keywords: | Plain weave C/SiC Fracture toughness Double cantilever beam(DCB) End notched flexure(ENF) |
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