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New insights into silver nanowires filled electrically conductive adhesives |
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| Authors: | Y. H. Wang N. N. Xiong H. Xie Y. Z. Zhao Jingze Li |
| Affiliation: | 1. Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan, 528402, China 2. State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Chengdu, 610054, China 3. Department of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China |
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