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Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints |
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| Authors: | Yingxin Goh A S M A Haseeb Haw Ling Liew Mohd Faizul Mohd Sabri |
| Affiliation: | 1. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia |
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