Diffusion Brazing of Al6061/15 Vol. Pct Al2O3p Using a Cu-Sn Interlayer |
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| Authors: | Kavian O Cooke Tahir I Khan Gossett D Oliver |
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| Affiliation: | 1. Department of Mechanical Engineering, University of Technology Jamaica, 237, Old Hope Road, Kingston, Jamaica
2. Department of Mechanical and Manufacturing Engineering, University of Calgary, 2500 University Drive, Calgary, AB, USA
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| Abstract: | Diffusion brazing of Al-6061 alloy containing 15 vol. pct Al2O3 particles was attempted using Cu-Sn interlayer. Joint formation was attributed to the solid-state interdiffusion of Cu and Sn followed by eutectic formation and subsequent isothermal solidification. Examination of the joint region using scanning electron microprobe analyzer (EPMA), wavelength dispersive spectroscopy (WDS) and X-ray diffraction (XRD) showed the formation of intermetallic phases such as Al7Cu3Mg3, Mg2Cu6Al5, Cu3Sn, and Mg2Sn. The results indicated an increase in joint strength with increasing bonding time giving the highest joint shear strength of 94 MPa at a bonding duration of 3 hours. |
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