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RTD/HFET low standby power SRAM gain cell
Authors:van der Wagt   J.P.A. Seabaugh   A.C. Beam   E.A.   III.
Affiliation:Raytheon TI Syst., Dallas, TX;
Abstract:A 50-nW standby power compound semiconductor tunneling-based static random access memory SRAM (TSRAM) cell is demonstrated by combining ultralow current-density resonant-tunneling diodes (RTDs) and heterostructure field-effect transistors (HFETs) in one integrated process on an InP substrate. This power represents over two orders of magnitude improvement over previous III-V static memory cells. By increasing the number of vertically integrated RTD's we obtain a 100 nW tri-state memory cell. The cell concept applies to any material system in which low current-density negative differential resistance devices are available
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