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Superelastic Multimaterial Electronic and Photonic Fibers and Devices via Thermal Drawing
Authors:Yunpeng Qu  Tung Nguyen‐Dang  Alexis Gérald Page  Wei Yan  Tapajyoti Das Gupta  Gelu Marius Rotaru  René M Rossi  Valentine Dominique Favrod  Nicola Bartolomei  Fabien Sorin
Affiliation:1. Laboratory of Photonic Materials and Fibre Devices (FIMAP), Institute of Materials, Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland;2. Swiss Federal Laboratories for Materials Science and Technology (Empa), St. Gallen, Switzerland
Abstract:Electronic and photonic fiber devices that can sustain large elastic deformation are becoming key components in a variety of fields ranging from healthcare to robotics and wearable devices. The fabrication of highly elastic and functional fibers remains however challenging, which is limiting their technological developments. Simple and scalable fiber‐processing techniques to continuously codraw different materials within a polymeric structure constitute an ideal platform to realize functional fibers and devices. Despite decades of research however, elastomeric materials with the proper rheological attributes for multimaterial fiber processing cannot be identified. Here, the thermal drawing of hundreds‐of‐meters long multimaterial optical and electronic fibers and devices that can sustain up to 500% elastic deformation is demonstrated. From a rheological and microstructure analysis, thermoplastic elastomers that can be thermally drawn at high viscosities (above 103 Pa s), allowing the encapsulation of a variety of microstructured, soft, and rigid materials are identified. Using this scalable approach, fiber devices combining high performance, extreme elasticity, and unprecedented functionalities, allowing novel applications in smart textiles, robotics, or medical implants, are demonstrated.
Keywords:advanced fibers  rheology  stretchable electronics  thermal drawing  thermoplastic elastomers
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