CO2 Laser Processing On Ceramic Substrates Of Light Emitting Diode Assisted By Compressed Gas

The use of ceramic substrates in high power LEDs is becoming increasingly common. However, the brittleness of ceramics makes them difficult to process and susceptible to cracking. This study used a CO₂ laser with auxiliary gas to drill and cut Al₂O₃ and AlN ceramic substrates. The authors investigated the influences of parameters such as auxiliary gas pressure, laser power, repetition rate, and working speed on processing quality, in terms of pattern size, surface roughness, hole taper angle, and fracturing. The experiment results show that Al₂O₃ low-cost processing can be achieved with low laser power and high auxiliary gas pressure. In contrast, AlN has a high melting point and high thermal conductivity, for which lower auxiliary gas pressure is required to ensure high-quality processing.