| LED键合机上下料机构设计 |
| |
| 引用本文： | 孔德生,潘峰,广明安. LED键合机上下料机构设计[J]. 电子工业专用设备, 2008, 37(8) |
| |
| 作者姓名： | 孔德生 潘峰 广明安 |
| |
| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,101601;中国电子科技集团公司第四十五研究所,北京,101601;中国电子科技集团公司第四十五研究所,北京,101601 |
| |
| 摘 要： | 主要介绍了键合机的上下料系统在生产线实践中的调试,应用,并基于生产线实践进行了新型键合机上下料机构的创新设计。
|
| 关 键 词： | 键合机 调试 创新 |
Stack Loader/Unloader Design of Automatic LED Wire Bonder Based on Packaging Product Line |
| |
| Kong De-sheng,Pan Feng,Guang Min-gan. Stack Loader/Unloader Design of Automatic LED Wire Bonder Based on Packaging Product Line[J]. Equipment for Electronic Products Marufacturing, 2008, 37(8) |
| |
| Authors: | Kong De-sheng Pan Feng Guang Min-gan |
| |
| Abstract: | This article introduced debugging and application for wire bonder elevator system in product line. An innovation of new wire bonder elevator system was designed based on Packaging Product Line. |
| |
| Keywords: | Wire Bonder Debugging Innovation |
| 本文献已被 维普 万方数据 等数据库收录！ |
|
