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新型多孔铜微通道热沉散热性能实验研究
引用本文:裘腾威,刘敏,刘源,张祎,张威. 新型多孔铜微通道热沉散热性能实验研究[J]. 热科学与技术, 2020, 19(4): 339-346
作者姓名:裘腾威  刘敏  刘源  张祎  张威
作者单位:宁波职业技术学院精密模具加工及智能制造应用研究中心,浙江宁波315800;清华大学材料学院,北京100084;宁波勋辉电器有限公司,浙江宁波315800
基金项目:浙江省教育厅一般科研项目
摘    要:新型多孔铜微通道散热技术采用多孔铜微通道结构,增加热沉与冷却工质的接触面积,提高热沉的散热性能。利用单室金属-气体共晶定向凝固工艺,通过控制冷却速度、过热度、气压等工艺参数,从而制备优质的多孔铜材料。根据多孔铜微通道热沉散热原理,搭建散热性能测试平台,研究冷却工质流量、多孔铜材料的孔径和孔隙率、入口截面斜率角对多孔铜微通道热沉散热性能的影响规律。结果表明:增加冷却工质流量有利于提高多孔铜微通道热沉的散热性能;在恒定体积流量下,减小孔径有利于提高多孔铜微通道热沉的散热性能;当多孔铜孔隙率为30.8%时,多孔铜微通道热沉散热性能最佳;入口截面斜率角对多孔铜微通道热沉散热性能的影响较小。

关 键 词:多孔铜  微通道热沉  散热性能  液冷散热器
收稿时间:2020-01-28
修稿时间:2020-04-19

Experimental Research On The Heat Transfer Performance Of A Novel Porous Copper Micro-channel Heat Sink
QIU Teng-wei. Experimental Research On The Heat Transfer Performance Of A Novel Porous Copper Micro-channel Heat Sink[J]. Journal of Thermal Science and Technology, 2020, 19(4): 339-346
Authors:QIU Teng-wei
Affiliation:Ningbo Polytechnic
Abstract:The porous copper micro-channel was used in novel porous copper micro-channel dissipation technology to increase contact area of heat sink and cooling medium and,improve the heat transfer performance of heat sink. Porous copper micro-channel material was produced by the GASAR process, which was a combination of a directional solidification process and a metal-gas eutectic reaction, controlling. The technology parameters of cooling speed, superheat degree and air pressure. Experimental heat transfer platform of porous copper micro-channel heat sink were set up. The effects offlow rate,pore diameter, porosity and slope angle of entrance section on the heat transfer performance were studied.The results exhibit that increasing the flow rate of cooling medium help to improve the heat transfer performance.When the flow rate is constant, reducing the pore diameter help to improve the heat transfer performance. The heat transfer performance of porous copper micro-channel heat sink arrives the optimal value when porosity is 30.8%. Meanwhile, the effect of slope angle of entrance section on the heat transfer performance can be neglected.
Keywords:porous copper   micro-channel heat sink   heat transfer performance   liquid-cooled radiator
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