LRM热传导结构在加固计算机中的研究与应用

为了有效提高现场可更换模块（Line Replaceable Module, LRM）热传导结构的导热效率，文中结合某加固计算机内LRM 的热设计，研制了能够有效实现热源散热需求的LRM 热传导结构，给出了降低LRM 热传导结构中接触热阻的有效措施。利用Icepak 热仿真软件对LRM 热传导结构进行了热仿真分析，得出了不同导热材质和不同导热填充介质对LRM 散热性能的影响，分析出了LRM 热传导结构散热效率的最优解决方案，并对LRM 在加固计算机内的散热性能进行了实际测试。结果表明，LRM 热传导结构的散热效率优于其他散热结构的散热效率，完全满足热源的散热要求。热仿真和热测试结果对比表明，Icepak 热仿真软件的计算结果与实际测试结果较为接近，在LRM 热设计阶段具有可参考性。

Research and Application of LRM Heat Conduction Structure in Rugged Computer

In order to effectively improve the thermal conductivity of heat conduction structure of the line replaceable module (LRM), combined with the thermal design of LRM in a rugged computer, the heat conduction structure of LRM which can effectively realize the heat dissipation requirement of heat source is developed and the effective measures to reduce the contact thermal resistance of LRM are given in this paper. The thermal simulation analysis of heat conduction structure of LRM is carried out by Icepak. The effect of different heat conduction materials and different heat conduction filling media on the heat dissipation performance of LRM is obtained and the optimal solution to the heat dissipation efficiency of heat conduction structure of LRM is analyzed. The heat dissipation performance of LRM in the rugged computer is tested actually. The result shows that the heat dissipation efficiency of heat conduction structure of LRM is better than that of other heat dissipation structures, which fully meets the heat dissipation requirements of heat source. The comparison results of thermal simulation and thermal test show that the calculation results of Icepak are close to the test results. The calculation results of Icepak have reference value at the thermal design stage of LRM.