| 硫酸钯活化印制电路铜箔化学镀镍 |
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| 引用本文： | 彭春玉. 硫酸钯活化印制电路铜箔化学镀镍[J]. 广东化工, 2010, 37(10): 29-29,34 |
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| 作者姓名： | 彭春玉 |
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| 作者单位： | 湖南大学化学化工学院,湖南长沙410182; |
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| 摘 要： | 文章介绍了以硫酸/硫酸钯作为印制电路铜箔化学镀镍的活化液。考察了表面活性剂的用量、活化时间及活化温度对化学镀镍的影响,确定了最佳的工艺参数。并对经该活化液活化的铜箔进行化学镀镍,通过扫描电镜(SEM)对化学镀镍层的微观形貌进行表征,同时考察了该镍层的钎焊性。研究结果表明,该活化液适用于印制电路铜箔的化学镀镍前活化。
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| 关 键 词： | 硫酸钯 活化 化学镀镍 印制电路板 |
Palladium Sulfate Activation for the Electroless Nickel Plating of PCB |
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| Peng Chunyu. Palladium Sulfate Activation for the Electroless Nickel Plating of PCB[J]. Guangdong Chemical Industry, 2010, 37(10): 29-29,34 |
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| Authors: | Peng Chunyu |
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| Affiliation: | Peng Chunyu (College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, China) |
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| Abstract: | H2SO4/PdSO4 solution was used to catalyze PCB copper circuit before electroless nickel plating. Influence of surfactant, catalyzing time and temperature on electroless nickel plating were investigated. And the technical parameter was confirmed. Electroless nickel plating was performed on the activated copper, the micro morphology of deposits was represented by S EM, and the solder ability of the deposits was also tested. The results indicated that the activation solution was applicable to the copper foil of printed circuit board. |
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| Keywords: | palladium sulfate activation electroless nickel plating printed circuit board |
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