| 叠层芯片封装元件热应力分析及焊点寿命预测 |
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| 引用本文： | 康雪晶,秦连城. 叠层芯片封装元件热应力分析及焊点寿命预测[J]. 电子元件与材料, 2007, 26(5): 66-68 |
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| 作者姓名： | 康雪晶 秦连城 |
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| 作者单位： | 桂林电子科技大学机电与交通工程系,广西,桂林,541004;桂林电子科技大学机电与交通工程系,广西,桂林,541004 |
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| 摘 要： | 研究了温度循环载荷下叠层芯片封装元件(SCSP)的热应力分布情况,建立了SCSP的有限元模型。采用修正后的Coffin-Masson公式,计算了SCSP焊点的热疲劳寿命。结果表明:多层芯片间存在热应力差异。其中顶部与底部芯片的热应力高于中间的隔离芯片。并且由于环氧模塑封材料、芯片之间的热膨胀系数失配,芯片热应力集中区域有发生脱层开裂的可能性。SCSP的焊点热疲劳寿命模拟值为1 052个循环周,低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
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| 关 键 词： | 电子技术 叠层芯片封装元件 焊点热疲劳寿命 热应力 |
| 文章编号： | 1001-2028（2007）05-0066-03 |
| 修稿时间： | 2007-01-31 |
Thermal stress analysis and fatigue life prediction for solder joint of SCSP |
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| KANG Xue-jing,QIN Lian-cheng. Thermal stress analysis and fatigue life prediction for solder joint of SCSP[J]. Electronic Components & Materials, 2007, 26(5): 66-68 |
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| Authors: | KANG Xue-jing QIN Lian-cheng |
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| Affiliation: | Dept of Electronic Machinery and Traffic Engineering, Guilin University of Electronic Technology, Guilin 541004, China |
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| Abstract: | A finite element modeling of SCSP was performed.The distribution of thermal stress of SCSP under temperature cycle was analyzed.Thermal fatigue life of solder joint was calculated by modified Coffin-Masson formula.Results show that different thermal stresses exist in stacked chips.Thermal stress of chips at the top and the bottom is higher than the center.As CTE mismatch of materials,it is possible that chips crack in thermal stress lumped rigion.The simulation value of solder joint thermal fatigue life is 1 052 circulations.The thermal fatigue life of solder joint in SCSP is lower than the single chip package(2 656 circulations). |
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| Keywords: | electron technology SCSP thermal fatigue life of solder joint thermal stress |
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