Substrate temperature effects on the microhardness and adhesion of diamond-like thin films |
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| Affiliation: | 1. Department of Mechanical Engineering and Materials Science and Engineering, Cyprus University of Technology, 3041 Lemesos, Cyprus;2. Research Unit for Nanostructured Materials Systems, Cyprus University of Technology, 3041 Lemesos, Cyprus;3. Department of Mechanical and Manufacturing Engineering, University of Cyprus, 75 Kallipoleos Av., P.O. Box 20537, 1678 Nicosia, Cyprus;4. Department of Materials Science and Engineering, University of Ioannina, GR-45110 Ioannina, Greece;5. Department of Physics, Aristotle University of Thessaloniki, GR-54124 Thessaloniki, Greece |
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| Abstract: | Diamond-like films were deposited on silicon substrates by r.f. plasma-enhanced chemical vapor deposition from gas methane. In this study, the substrate temperature, TS, was varied in a wide range from 20 to 370°C while maintaining fixed other important process parameters such as r.f. power (70 W) or pressure (2.5 Pa). The increase of TS causes an increase of the sp2/(sp2+sp3) bonded carbon ratio and a decrease of the hydrogen content. These changes produce a great modification of the mechanical properties: microhardness, friction coefficient and adhesion. The variations of mechanical properties with TS correlate well with the sp2/(sp2+sp3) bonded carbon ratio and the hydrogen content in the films showing a gradual transformation of the diamond-like structure into a more sp2-rich one. |
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