Water glass bonding |
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| Affiliation: | 1. Laboratoire de Physique de la Matière Condensée, Ecole Polytechnique, CNRS, IP Paris, 91128 Palaiseau, France;2. Laboratoire Surface du Verre et Interfaces (SVI), UMR 125 CNRS/Saint-Gobain Recherche, 93303 Aubervilliers, France;3. Université de Lille, CNRS, UMR 8516-LASIR-Laboratoire de Spectrochimie Infrarouge et Raman, F-59000 Lille, France;4. Département Couches Minces, Saint-Gobain Recherche, 93303 Aubervilliers, France;1. Laboratory of Applied Inorganic Chemistry, University of Yaounde I, Faculty of Science, Department of Inorganic Chemistry, PO. Box 812, Yaounde, Cameroon;2. Institut für Mineralogie, Leibniz Universität Hannover, Callinstrasse 3, D-30167 Hannover, Germany |
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| Abstract: | The author developed a low-temperature (80°C), low-external loads (electric field, magnetic field, load, etc.) bonding technology using water glass which is used in making molds (silica sand). The adhesive area ratio attained by this bonding technology was more than 95% and the bonding strength was about 290 kgf/cm2. As this water glass bonding technology is applicable at comparatively low-temperatures, the residual stress of the bond is so small as to be able to bond eight 4-inch wafers together in the 3rd dimensional direction. In addition, as the thickness of a bonding layer is as small as several nanometers, the precision bonding of a tolerance of ±3 μm was also possible through alignment, and we could successfully fixed a cap with having a bonding seal of 0.32 mm wide in the vacuum. The leak rate was less than the detection limit of the He leak detector (1×10−10 Pa m3/s), showing excellent air-tightness. Using this bonding technology, the author made a self-package type IR microsensor on an experimental basis, and carried out an accelerated environmental test. As a result, its MTTF (mean time to failure) was estimated to be 6 years. |
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