Metrology of high aspect ratio MEMS

Lack of metrology tools for inspecting high aspect ratio MEMS severely limits the degree to which tolerances of a given part can be examined. Tools such as SEMs, AFMs, vision-based systems, and profilometers are good at examining two-dimensional entities of a part or for calculating surface roughness characteristics. None of these tools, however, can extract full three-dimensional data sets of high aspect ratio MEMS for part inspection. The hardware is either limited by the steep sidewalls of the part or by the simple fact that the acquisition method only collects two-dimensional data. This research proposes a method for extracting three-dimensional information from a part using multiple two-dimensional pointclouds. A fiducial setup is proposed which would allow for the registration of multiple pointclouds. A computer-aided inspection (CAI) software platform has been developed to handle the multiple data sets. The software platform implements a least-squares localization routine to compute the best-fit deviations from the nominal CAD geometry, as well as algorithms to determine the correct alignment between two pointclouds. With this software platform, both form errors of a single pointcloud and geometric errors with respect to multiple pointclouds can be calculated.This work was partially funded by Sandia National Laboratories and the National Science Foundation under Grant Number DMI-9988664. The government has certain rights in this material. Any opinions, findings and conclusions or recommendations are those of the authors and do not necessarily reflect the views of the Sandia National Laboratories or National Science Foundation.This paper was presented at HARMST 2003 in June 2003.