Effect of Silicon on Hot Shortness in Fe-Cu-Ni-Sn-Si Alloys During Isothermal Oxidation in Air |
| |
Authors: | Erica Sampson Seetharaman Sridhar |
| |
Affiliation: | 1. Carnegie Mellon University, Pittsburgh, PA, USA 2. TATA Steel/Royal Academy of Engineering and Joint Chair for Research into Low C Materials Technology, International Digital Laboratory, Warwick Manufacturing Group, The University of Warwick, Coventry, U.K.
|
| |
Abstract: | Residual Cu in scrap-based EAF steel leads to a surface-cracking phenomenon known as surface hot shortness. Si is known to provide a potential reduction in hot shortness; however, the mechanisms involved are not fully understood for low Si quantities. The current study aims to determine a window of Si contents with a given Ni content needed to counteract the negative effects of Sn and Cu to reduce hot shortness and to determine the mechanism. Thermogravimetric analysis (TG), SEM-EDS, XRD, and TEM were used to study the hot shortness behavior of Fe containing 0.2 pct Cu, 0.05 pct Ni, 0.01 pct Sn and with varying Si-content (0.02 pct, 0.1 pct, 0.15 pct, and 0.2 pct Si). It was found that the fayalite formation resulting in a reduction of oxidation and consequently liquid Cu formation occurred for all Si contents examined. The range of Si contents between 0.1 and 0.2 wt pct Si exhibited a mechanism that was a combination of fayalite formation impeding oxidation as well as occlusion of the Cu-rich liquid. This range was acceptable to alleviate hot shortness. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|