粉末冶金法制备金刚石/铜复合材料热导率研究

为研制更高热导率的产品，采用粉末冶金法将金刚石与高纯度铜粉热压在一起，制备新型金刚石/铜复合材料。通过正交分析法，研究了金刚石/铜复合材料热导率的影响因素。结果表明:用粉末冶金法制备的金刚石/铜复合材料，其热导率最高为245.89 W/（m·K）。对金刚石/铜复合材料热导率影响最大的因素是金刚石与铜粉的体积比，并且随着体积比的增大，金刚石/铜复合材料热导率逐渐下降。金刚石/铜复合材料的致密度以及界面结合程度是影响金刚石/铜复合材料热导率大小的重要因素，致密度高、界面结合好的复合材料热导率高，反之则低。 

Thermal conductivity of diamond/copper composites prepared using powder metallurgy

To prepare material with higher thermal conductivity,new diamond/copper composite material was hot-pressed using powder metallurgy method with diamond and high purity copper powders.Orthogonal analysis was used to study the influencing factors of thermal conductivity of diamond/copper composite material.Resultsshowed that maximum thermal conductivity of new material was 245.89 W/(m·K)and that volume ratio of diamond to copper powders influenced thermal conductivity most. With the increase of volume ratio,thermal conductivity of diamond/copper composite material gradually decreased.Densification and interface bonding factor were important factors as well.Composite material with higher densification and better interface bonding possessed higher thermal conductivity and vice versa.