| 线性电位扫描方法在电镀生产研究中的应用 |
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| 引用本文： | 陈永言. 线性电位扫描方法在电镀生产研究中的应用[J]. 电镀与涂饰, 1997, 16(1): 1-5 |
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| 作者姓名： | 陈永言 |
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| 作者单位： | 武汉大学化学系!430072 |
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| 摘 要： | 评述了线性电位扫描方法在电镀生产研究中的应用，对稳态极化曲线，循环伏安曲线所表示的意义以及电结晶过程，阳极溶解过程，欠电位沉积等的伏安曲线进行了讨论。
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| 关 键 词： | 电镀 线性电位扫描 循环伏安法 电化学 |
Application of Linear Potential Sweep Method in Electroplating |
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| CHEN Yongyan. Application of Linear Potential Sweep Method in Electroplating[J]. Electroplating & Finishing, 1997, 16(1): 1-5 |
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| Authors: | CHEN Yongyan |
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| Affiliation: | CHEN Yongyan |
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| Abstract: | Applications of linear potential sweep method in electroplating research are introduced. The voltammetric curves of electrocrystallization, anodic dissolution and ullaged potential deposition phenomena as well as the information shown in the steady-state and cyclic voltammetric curves are studied. |
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| Keywords: | electroplating linear potential sweep voltammetry |
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