Modelling of plasma etching using a generalized regression neural network |
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Authors: | Byungwhan Kim Sungmo KimKunho Kim |
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Affiliation: | Department of Electronic Engineering, Sejong University, 98 Kunja-Dong, Kwangjin-Ki, Seoul 143-747, South Korea |
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Abstract: | Plasma etching was modelled by using a generalized regression neural network (GRNN). The etching process was characterized with a statistical experimental design. Three etch responses were modelled, which include two etch rates of aluminium and silica and etching profile. GRNN prediction ability was optimized as a function of training factor. Three types of models were constructed depending on the type of prepared data. Type I model corresponds to the model constructed with the original, non-classified data. Type II and III models were built for the classified data without and with the control of data interface, respectively. Compared to type I models, type II models for two etch rates demonstrated more than 25% improvement. By the control of data interface, type III models exhibited more than 15% improvement over type II models. Classification-based models in conjunction with data control thus illustrated much improved prediction of GRNN over those for non-classified models. |
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Keywords: | Neural network Plasma etching Modelling |
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