| 基于热分析的电子元器件可靠性探讨 |
| |
| 引用本文： | 钱俊锋
,章云峰
,郑荣良
,张荣标.基于热分析的电子元器件可靠性探讨[J].微计算机信息,2005(22). |
| |
| 作者姓名： | 钱俊锋 章云峰 郑荣良 张荣标 |
| |
| 作者单位： | 江苏大学汽车与交通工程学院 212013江苏镇江(钱俊锋，郑荣良
)，江苏大学电气信息工程学院 212013江苏镇江(章云峰，张荣标) |
| |
| 基金项目： | 江苏省教育厅科研基金资助项目项目编号:00KJD510007 |
| |
| 摘 要： | 介绍了温度对电子设备中一些常见元器件的性能影响。在一种车载电子设备的热设计过程中,根据实测结果分析了CPU、电源模块和外围电路元器件的温度特性,并结合热分析软件进行热优化设计,提高了系统的可靠性。
|
| 关 键 词： | 可靠性 温度特性 热优化设计 |
A Preliminary Study on Improving the Reliability of Electronic Components |
| |
| Qian,Junfeng Zhang,Yunfeng Zheng,Rongliang Zhang,Rongbiao.A Preliminary Study on Improving the Reliability of Electronic Components[J].Control & Automation,2005(22). |
| |
| Authors: | Qian Junfeng Zhang Yunfeng Zheng Rongliang Zhang Rongbiao |
| |
| Affiliation: | (Jiangsu University,Zhenjiang 212013,China) Qian,Junfeng Zhang,Yunfeng Zheng,Rongliang Zhang,Rongbiao |
| |
| Abstract: | The influence of temperature to the performance ofsome familiar electronic components is introduced. During thethermal design procedure of a vehicle - based electronic equip-ment, analyze the temperature characteristic of CPU, power sup-ply module and periphery circuit components based on the re-sults of measurement, and carry though the optimal thermal de-sign combined with thermal analysis software. The reliability ofelectronic system is well improved. |
| |
| Keywords: | Reliability Temperature characteristic Optimalthermal design |
| 本文献已被 CNKI 等数据库收录！ |
|
