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Adhesion Enhancement of Diamond Films on Various Substrates by Carbide Interlayer
Authors:Hidetoshi Saitoh  Shoichi Ozeki  Ryoichi Urao
Affiliation:  a Department of Materials Science, Faculty of Engineering, Ibaraki University, Hitachi, Ibaraki, Japan
Abstract:Diamond films were prepared on various substrates by a combustion flame technique using an oxyacetylene torch. During the deposition, a carbide interlayer was formed between the surface of the substrate and deposited diamond. The hard interlayers were seen on the molybdenum, tungsten as well as silicon substrates. The adhesion of diamond on the molybdenum substrate was improved with increase in the hardness of the carbide layer. This result strongly supports the premise that the carbide interlayer and/or carbon diffused layer enhances the adhesion of diamond to substrates.
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