Sn基无铅焊料的研究进展

随着世界各国“限铅令”的颁布,Sn基无铅焊料被广泛研究以代替传统Sn-Pb焊料。然而,近年来大规模集成电路及先进电子封装架构的发展对无铅焊料的性能提出了更高要求。本文介绍了Sn-Sb、Sn-Cu、Sn-Ag、Sn-Zn、Sn-Bi和Sn-In系等主要无铅焊料体系的最新研究进展,综述了添加合金元素、稀土元素以及纳米颗粒对焊料显微组织、润湿性能、力学性能、耐蚀性能和接头服役性能的影响。文章最后讨论了高性能无铅焊料的研发方向,提出了创新的研究理念及研究方法,为下一代钎焊材料的研发提供了参考。

Research Progress of Sn-based Lead-free Solder

With the promulgation of the "Pb Restriction Laws" in various countries around the world, Sn-based lead-free solders have been widely studied to replace traditional Sn-Pb solders. However, the development of large-scale integrated circuits and advanced electronic packaging architectures in recent years has placed higher demands on the performance of lead-free solders. This review paper introduced the latest research progress on the main lead-free solder systems such as Sn-Sb, Sn-Cu, Sn-Ag, Sn-Zn, Sn-Bi, and Sn-In systems. And the effects of adding microalloying elements, rare earth elements, and nanoparticles on the microstructure, wettability, mechanical properties, corrosion resistance, and service performance of solder were also reviewed. The main development trends of high-performance lead-free solder were discussed, and innovative research concepts and methods were proposed for the development of next-generation brazing materials.