白光LED封装工艺研究

本文通过对封装辅料及涂覆工艺的研究,分析了LED荧光粉粒径、模条卡点及涂覆方式对白光LED光学性能的影响。实验采用小功率直插式LED封装工艺,结果表明,选择小粒径的荧光粉可以显著提高产品的光色均匀性;使用高卡点的模条及高涂覆方式,可以提升发光效率5%以上;而采用相反方式涂覆工艺,垂直光强可相对增加30%以上。

Research On Packaging Technology of WLED

The effects of LED phosphor＇s particle size, model bar＇s wedge height and coating quantity on the optical properties of dip- low power WLED are analyzed respectively. Results show that color uniformity can be improved obviously by choosing phosphor with smaller granularity; The luminous efficacy can be enhanced over 5% and 30% respectively in the case of more luminous quantity and lower wedge; However, the vertical light intensity can be increased over 30% and 70% by using otherwise way.